T02400 - SEMI T24 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications StdTpc-Electronic Data Interchange one of the problems is

one of the problems is to identify and eliminate the sources of mechanical defects such as thermo-elastic stress and cracks leading to the loss of wafer integrity and ultimate breakage of as-grown and processed Si cells

org in June 2015

the form includes many items that are not currently included in the SEMI specifications

robotics suppliers

Automated Materials Handling System (AMHS)

T02400 - SEMI T24 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications StdTpc-Electronic Data Interchange one of the problems isThis Specification is intended to provide a marking symbology that can be used to mark glass carrier characteristics for panel level packaging (PLP). This Specification defines the geometric shape, size and content of a rectangular two dimensional (2D) code symbol for back surface marking of the glass carrier for use in PLP applications. Although this Specification does not specify the marking techniques that may be employed when complying with its