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Surface Preparation & Cleaning Conference (SPCC) 2026 StdPbc-0516 SEMI D57-0310 (first published)

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SEMI D57-0310 (first published)

1 — Specification for SOAP Implementation of Equipment Self Description

本仕様では，半導体および電子デバイスの製造に使用される円盤状100 mm高純度単結晶ゲルマニウムウェーハの基板に関する要求事項をカバーする。

and precipitates/inclusions

SEMI E87-0707 (technical revision)

Surface Preparation & Cleaning Conference (SPCC) 2026 StdPbc-0516 SEMI D57-0310 (first published)

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