G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced or remove instances of objects

or remove instances of objects (and manage collections of those objects) that support the CIM Framework specified interfaces

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This Specification covers the substrate requirements for monocrystalline high-purity indium phosphide wafers used in semiconductor and electronic device manufacturing

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G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced or remove instances of objectsThis specification defines the acceptance criteria for ceramic pin grid array packages produced utilizing pressed ceramic, mechanically inserted pins and solder for electrical interconnection of pins. Referenced SEMI Standards None.