MC392 Mid-Volume Pick & Place freight The system uses controlled ultrasonic

The system uses controlled ultrasonic energy to remove solder paste from stencils

The welded steel frame—up to five times heavier than comparable systems—reduces vibration and maintains alignment

Guided setup workflow: quickly configure PCB layout

Wide component support: BGAs

and supports a cleaner

MC392 Mid-Volume Pick & Place freight The system uses controlled ultrasonicSMD Component Versatility and Precision Placement The MC392 delivers precise placement with 30 m accuracy (3 Sigma), handling components from 01005 up to 100 150 mm, making it ideal for high mix production environments. 01005 to large components: supports parts up to 100 150 mm 30 m accuracy (3 Sigma): ensures consistent, repeatable placement Cognex on the fly vision: head mounted cameras for fast, non contact alignment Upward looking camera: aligns