G03800 - SEMI G38 - 静止空気および強制風冷によるICパッケージのジャンクション部周囲間の熱抵抗の測定法 StdPbc-0720 SEMI E88-1104 (technical revision)

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SEMI E88-1104 (technical revision)

SEMI D20-0706 (Reapproved 0815)

to be published February 1999

This proposal uses these methods to describe data structures for crystalline and thin film equipment

and mechanical properties of FPD substrates

G03800 - SEMI G38 - 静止空気および強制風冷によるICパッケージのジャンクション部周囲間の熱抵抗の測定法 StdPbc-0720 SEMI E88-1104 (technical revision)global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1987200411 : IC Referenced SEMI Standards SEMI G32 Guideline for Unencapsulated Thermal Test Chip SEMI G42 Specification for Thermal Test Board Standardization for Measuring Junction to Ambient Thermal Resistance of Semiconductor Packages

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