G08100 - SEMI G81 - Specification for Map Data Items StdDcs-Current bumps or waves on the

bumps or waves on the wafer surface that vary in peak to valley height from a few nanometers to a several hundred nanometers

This document incorporates pertinent dimensional data from SEMI D18

Field sequential color technique in the flat panel display has become more and more important

The grid described is referenced to the center of the wafer

These conditions may include any aspects of the measurement system affecting the measurement results directly or indirectly (e

G08100 - SEMI G81 - Specification for Map Data Items StdDcs-Current bumps or waves on theThis Document describes the data items that relate to electronic substrate mapping. This Document applies only to substrate map data items. This Document does not address the transmission, file naming conventions, storage or archiving of substrate maps. The Specification of which data items are optional and which are required is not specified in this Document. The size of each data item described in this Document is maximum size. The actual size may