G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded higher-level injection is often adopted

higher-level injection is often adopted

used to ship

A brief description of the theory of this Test Method is given in Related Information 1

The dynamic test method evaluates performance during component operation and provides an indication of the steady state particle contribution due to dynamic operating conditions

SEMI M56-1018 (Reapproved 1023)

G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded higher-level injection is often adoptedglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.