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G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive SEMI A2 — Specification for
G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive SEMI A2 — Specification for
$115.50
Description
SEMI A2 — Specification for Surface Mount Assembler Smart Hookup (SMASH)
1 This Specification may be applied to equipment that is compliant to SEMI E30 (GEM)
The procedures may be used by the material manufacturer for quality control or by a customer at incoming inspection
data reports
timeliness
G09300 - SEMI G93 - ボール・グリッド・アレイ（BGA）パッケージ用はんだボールの測定方法 Revision:SEMI G93-0412 - Inactive SEMI A2 — Specification forglobal Assembly & Packaging Technical Committee2012221global Audits and Reviews Subcommittee20124www. semiviews. org www. semi. org BGA Referenced SEMI Standards None.
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